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Package Modeling Needs For A Robust IC Power Integrity Sign-Off
Progress in IC technology has allowed chip designers to pack more functionality and continually make better use of silicon area. This trend, coupled with the need to maintain low power using techniques...
View ArticleAutomotive Drives Novel IP Demands
In the past the automotive industry was a bit sleepy when it came to technologic innovations. Clearly, this is no longer the case. The automotive segment is now driving interesting capabilities and an...
View ArticleThermal Is Still Simmering
With the ever increasing sophistication in today’s high-performance SoCs on top of sheer physics of device manufacturing, thermal is a much bigger concern than ever before. It is well understood that...
View ArticleIs Dark Silicon Wasted Silicon?
The concept of dark silicon sounds almost mysterious, but it is a simple matter of physics. With advances in technology nodes and the ability to pack more and more transistors on the same die, design...
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The Wild West Of Automotive
Automotive is considered one of the great new markets for EDA and IP. Electronic complexity is increasing rapidly, product update cycles are decreasing, and new standards mean that many of the old ways...
View ArticleStacked Die, Phase Two
The initial hype phase of 2.5D appears to be over. There are multiple offerings in development or on the market already from Xilinx, Altera, Cisco, Huawei, IBM, AMD, all focused on better throughput...
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How Switching Activity Impacts A Design’s Power And Reliability
Electronics continue to gain presence in both familiar and unfamiliar areas of our lives. Electronics is a common thread among the cars we drive, the computers we use, the mobile phones and wearable...
View ArticleRethinking Power
Power typically has been the last factor to be considered in the PPA equation, and it usually was somebody else’s problem. Increasingly it’s everyone’s problem, and EDA companies are beginning to look...
View ArticleSynopsys To Buy Atrenta, Ansys To Acquire Gear
By Ann Mutschler & Ed Sperling As evidence of the continued consolidation in the EDA industry, Synopsys announced Sunday it would acquire privately held formal verification provider Atrenta, for an...
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Early Power Budgeting for Live Applications
Today, power and energy efficiency are at the forefront of SoC design. Functional activity has a first-order impact on power. Increasing functional integration requires a comprehensive analysis of...
View ArticleMaking Cars Smarter
The fuel injection control unit has come a long way since 1983 when Ford Motor Co. first included a 16-bit Intel microcontroller-based fuel injection system in its 4-cylinder Escort. Today, some high...
View ArticleUpcoming Hurdles For The Semiconductor Industry
Semiconductor Engineering sat down to discuss upcoming challenges and hurdles to overcome for the semiconductor industry with Vic Kulkarni, senior vice president and general manager, RTL Power Business...
View ArticleDo Circuits Whisper Or Shout?
Maximizing SoC performance and minimizing power is becoming a multi-layered and multi-company challenge that depends on everything from ecosystem feedback and interactions to micro-architectural...
View ArticleWhy Packaging Matters
The semiconductor package is changing. What was until very recently considered an afterthought is now becoming a key part of the design process at all major chipmakers, and a critical factor in the...
View ArticleLow Power Design Analysis
This paper presents a methodology for comprehensive power grid verification coverage, including identification of power grid weaknesses early in the design cycle. To read more, click here.
View ArticleUpcoming Hurdles For The Semiconductor Industry
Semiconductor Engineering sat down to discuss upcoming challenges and hurdles to overcome for the semiconductor industry with Vic Kulkarni, senior vice president and general manager, RTL Power Business...
View ArticleAnalyzing The Integrity Of Power
Power analysis is shifting much earlier in the chip design process, with power emerging as the top design constraint at advanced process nodes. As engineering teams pack more functionality and content...
View ArticleThermal Issues Getting Worse
Making sure that smartphone you’re holding doesn’t burn your face when you make a call requires a tremendous amount of engineering effort at all levels of the design – the case, the chips, the...
View ArticleFirst Look: 5nm
By the time the 5nm semiconductor manufacturing process node reaches mass production readiness, the hurdles and challenges will no longer be open for discussion. But as of this moment, some of them...
View ArticlePower Requires Holistic Perspective
With the move to smaller manufacturing nodes, power must be looked at from a holistic perspective. Instead of just optimizing a device or devising next generation power gating, power must be considered...
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